PCB Fabrication & Assembly (PCBA)

Fabricate, assemble, test, and ship—end‑to‑end production with rigorous quality checks and clear documentation.

From Gerbers to Box‑Ready Boards

We run DFM, fabricate with the right stackup and finish, assemble SMT/TH parts, inspect with AOI/X‑ray, validate with functional tests, and deliver ESD‑safe packed units—ready for pilot or production.

Photorealistic PCB fabrication & assembly—panels, stencil, pick-and-place, AOI

What You Get

Turnkey or consigned—our PCBA flow minimizes surprises and accelerates first‑pass yield.

DFM & Panelization

Gerber sanity checks, stackup selection, impedance targets, panel frames, fiducials, tooling holes, V‑cut/tab‑routing.

Fabrication

2 layers FR‑4 (Std/Hi‑TG), 1–3 oz Cu, ENIG/HASL‑LF/OSP, solder mask colors, tented vias, controlled impedance on request.

Assembly

Stencil + reflow (SMT), wave/selective (TH), fine‑pitch/QFN/BGA/uBGA, conformal coating optional, rework stations.

Inspection & Test

SPI/AOI, X‑ray for BGA, flying‑probe/ICT where applicable, functional test (FCT) jigs, burn‑in profiles for power boards.

Procurement & Alternates

Turnkey sourcing via Robu.in/Mouser India/element14/LCSC with vetted alternates; MSL handling & bake logs maintained.

Quality & Compliance

IPC‑A‑610 Class II/III, RoHS lead‑free, ESD‑safe packaging, traceability labels, and shipment QC reports.

How We Work

01

DFM Review & Quote

Review Gerbers/BOM/CPL, confirm stackup/finish, suggest risk fixes, finalize pricing and schedule.

02

Fabrication & Sourcing

Start fab and component procurement; create stencil and program PnP with reference designators.

03

Assembly & Inspection

SMT/TH assembly, reflow/wave, SPI/AOI/X‑ray checks, visual QA, and rework if needed.

04

Test, Pack & Ship

Run FCT/ICT/burn‑in as scoped, label units, ESD‑pack, share QC report and tracking. Pan‑India delivery.

Deliverables

  • Assembled boards (PCBA) with serial/lot labels and COQ report
  • QC pack: SPI/AOI/X‑ray images, reflow profile, test logs
  • Packaging list + BoM revision + alternates actually used
  • Leftover components, stencils, and programming files on request

FAQs

Both. We can fully source, fully use your parts, or run a hybrid (we source passives/standard ICs, you provide specials).

Typical: 2–8 layers, 4/4 mil track/space, 0.25 mm laser vias, 0.3 mm finished vias, ENIG/HASL‑LF/OSP, impedance control, BGA down to 0.5 mm pitch (tighter on request).

Yes—silicone or acrylic coatings, masking as required, and trial fits with provided STEP enclosures before shipment.

Gerber X2, NC drill/slots, BOM with MPNs & alternates, CPL/centroid with rotations, assembly notes, and desired quantity/lead‑time.

Capability Snapshot

  • Layers: 2
  • Finishes: ENIG · HASL‑LF · OSP
  • Track/Space: 4/4 mil (tighter on request)
  • Vias: 0.3 mm finished · tented/plugged; via‑in‑pad on request
  • Assembly: SMT/TH · BGA/uBGA · selective wave
  • QC: SPI · AOI · X‑ray · FCT/ICT
  • Lead Times: Proto 5–10 days · Pilot 2–4 weeks
  • Logistics: Pan‑India shipping with ESD/MBB packaging
“Excellent first‑pass yield and clear QC documentation. Their alternates saved our schedule during a parts crunch.”
Client testimonial
Kaasim Badi
PCB Expert , UltraGen Technologies

Need boards built?

Send your Gerbers, BOM, and CPL to receive a DFM check and quote.

Request a PCBA Quote

Included With Every Build

  • DFM notes & panel drawing
  • Reflow profile & inspection photos
  • Traceability labels & packing list
  • Post‑build review with improvement suggestions